Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-06-08
1995-03-28
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174263, 174262, 361778, 361795, H05K 111
Patent
active
054019133
ABSTRACT:
A multi-layer circuit board includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
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Gerber Joel A.
Gits Peter A.
Buckingham Stephen W.
Griswold Gary L.
Kirn Walter N.
Minnesota Mining and Manufacturing Company
Picard Leo P.
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