Electrical interconnections

Details Electrical interconnections Electrical interconnections

1998-09-01

2000-10-24

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, 174260, 361767, 361773, 361774, 257773, H01R 1204, H05K 111

Patent

active

061370630

ABSTRACT:
The present invention includes electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive. In one embodiment, an electrical interconnection configured to electrically couple a first substrate and a second substrate includes: a bond pad of the first substrate having a male configuration; and a bond pad of the second substrate having a female configuration, the bond pad of the second substrate being configured to mate with the bond pad of the first substrate during electrical connection of the bond pads of the first substrate and the second substrate. A method of conducting electricity according to the present invention includes providing first and second bond pads individually defining a planar dimension; coupling the first and second bond pads at an interface having a surface area greater than the area of the planar dimension; and conducting electricity between the first and second bond pads following the coupling.

REFERENCES:
patent: 3757075 (1973-09-01), Munt
patent: 4752027 (1988-06-01), Gschwend
patent: 4818728 (1989-04-01), Rai et al.
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 4914057 (1990-04-01), Gloton
patent: 4922321 (1990-05-01), Arai et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4970780 (1990-11-01), Suda et al.
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5068714 (1991-11-01), Seipler
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5258577 (1993-11-01), Clements
patent: 5426266 (1995-06-01), Brown et al.
patent: 5505367 (1996-04-01), Degani et al.
patent: 5517752 (1996-05-01), Sakata et al.
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5767580 (1998-06-01), Rostoker
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 5808878 (1998-09-01), Saito et al.
patent: 5886415 (1999-03-01), Akagawa
patent: 5926694 (1999-07-01), Chigawa et al.
Assembly with Conductive Adhesives, K. Gilleo, Solder and Surface Mount Technology, No. 19, p. 12, Aug./Sep., 1994.
An Approach to the Anisotropic Conductive Adhesives for Micro-Interconnection Technology, Takao Komukai, Misuaki Miyazaki and Yuki Samejima, vol. 1, pp. 402-407, Sep. 10-12, 1996.
A New Anisotropic Conductive Film with Arrayed Conductive Particles, Kazuo Ishibashi and Jun Kimura, vol. 19, No. 4, pp. 752-757, Nov. 1996.
Bond ICs to PCBs Without Overkill or Underfill and ACP Types/Applications, Toshiba Chemical America, Inc., Advanced Packaging, Mar. 1997.

Affiliated with

Also associated with

Rating

Electrical interconnections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical interconnections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical interconnections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1965946