Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-12-14
1994-08-30
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
29846, H01R 909
Patent
active
053422074
ABSTRACT:
A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26). The projections are formed from substantially inelastic dielectric material, such as an epoxy, defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70). Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).
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Abrams Neil
Denson-Low W. K.
Hughes Aircraft Company
Lachman M. E.
Sales M. W.
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