Electrical interconnection method

Details Electrical interconnection method Electrical interconnection method

1995-11-08

1998-02-24

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 156305, 29832, 29842, 361768, 361770, H05K 332

Patent

active

057208433

ABSTRACT:
An electrical interconnection method, where two substrates are interconnected by an electrical connection medium, includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; depositing paste on the connection surface of another substrate; and interconnecting the connection surfaces of the two substrates. Also, the interconnection method according to another embodiment embodiment includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; contacting the connection surfaces of the two substrates; and injecting paste into a gap between the two substrates to interconnect the two substrates.

REFERENCES:
patent: 4696860 (1987-09-01), Epperson
patent: 5076485 (1991-12-01), MacKay
patent: 5332869 (1994-07-01), Hagiwara
patent: 5588894 (1996-12-01), Jin et al.

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