Electrical interconnection having angular lead design

Details Electrical interconnection having angular lead design Electrical interconnection having angular lead design

1990-10-29

1991-12-10

James, Andrew J.

357 80, 357 68, H01L 2348

Patent

active

050722794

ABSTRACT:
An electrical interconnection is provided for electrically and physically connecting a plurality of bonding sites on an integrated circuit chip to a plurality of external electrical connections. The electrical interconnection contains a plurality of individual electrical leads which have been formed so as to have the same degree of non-perpendicularity with respect to the rectangular shape of the integrated circuit. All of the individual leads are angled so as to rotate in the same direction around the integrated circuit. This angled lead design provides enhanced strain relief and improved performance during use since the integrated circuit is free to rotate under an applied stress, while efficiently maximizing the number of available electrical leads for bonding to the integrated circuit chip. In addition, this electrical interconnection is suitable for use with tape automated bonding methods.

REFERENCES:
patent: 3803458 (1974-04-01), Morena, Jr.
patent: 3902148 (1975-08-01), Drees et al.
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4003073 (1977-01-01), Helda et al.
patent: 4529999 (1985-07-01), Bender et al.
patent: 4667219 (1987-05-01), Lee et al.
patent: 4789889 (1988-12-01), Morris et al.
U.S. Patent Application Ser. No. 07/448,453 filed Dec. 11, 1989 to Charles T. Eytcheson, Entitled "Interconnection Lead Having Individual Spiral Lead Design".

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