Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2003-10-15
2008-08-05
Norris, Jeremy C (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C174S268000, C257S737000, C257S785000
Reexamination Certificate
active
07408119
ABSTRACT:
Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.
REFERENCES:
patent: 4686492 (1987-08-01), Grellmann et al.
patent: 5583468 (1996-12-01), Kielmeyer et al.
patent: 6313519 (2001-11-01), Gainey et al.
patent: 6548893 (2003-04-01), Chen et al.
patent: 6784090 (2004-08-01), Fujihara
patent: 6908843 (2005-06-01), Baldonado et al.
patent: 55-118643 (1980-09-01), None
patent: 2003-086621 (2003-03-01), None
Abstract of JP 55-118643.
Machine translation of JP2003-086621.
Sutono et al., Experimental Modeling, Repeatability Investigation and Optimization of Microwave Bond Wire Interconnects, IEEE Transactions on Advanced Packaging, vol. 24, No. 4, 595-603 (Nov. 2001).
Alpha Industries, Circuit Models for Plastic Packaged Microwave Diodes, Application Note 1001, 1-4 (Jun. 1999).
Cherry et al., FDTD Analysis of High Frequency Electronic Interconnection Effects, IEEE Transactions on Microwave Theory and Techniques, vol. 43, No. 10, 2445-51 (Oct. 1995).
Yun et al., Parasitic Impedance Analysis of Double Bonding Wires for High-Frequency Integrated Circuit Packaging, IEEE Microwave and Guided Wave Letters, vol. 5, No. 9, 296-98 (Sep. 1995).
Akinwande Deji
Clatterbaugh Jim
Qin Xiaohui
Stephens James P.
Zinsmaster Robin
Agilent Technologie,s Inc.
Norris Jeremy C
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