Electrical interconnection assembly manufacturing apparatus

Wireworking – Article making or forming – Forms and frames

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Details

29755, B21F 2700

Patent

active

053907108

ABSTRACT:
An apparatus for manufacturing electrical interconnection assembly in which a wire is laid on wire laying pins on a pin board or an insulating support body at high velocity and with high density. The electrical interconnection assembly manufacturing apparatus according to the present invention comprises: a pinboard; a plurality of wire laying pins standing on the pinboard; a slide plate opposing tips of the wire laying pins; and a nozzle attached to the slide plate, wherein the pinboard and the slide plate relatively move under the condition that the pinboard opposes the slide plate while a wire fed from the nozzle is laid on the plurality of wire laying pins.

REFERENCES:
patent: 3523353 (1970-08-01), Drinkard et al.
patent: 3804130 (1974-04-01), Tarbox et al.
patent: 3989338 (1976-11-01), Gosser
patent: 5156557 (1992-10-01), Okafuji et al.

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