Electrical interconnection apparatus for achieving precise align

Details Electrical interconnection apparatus for achieving precise align Electrical interconnection apparatus for achieving precise align

1989-03-13

1990-06-19

Hannaher, Constantine

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

357 68, 250332, H01L 2348, H01L 2313

Patent

active

049356275

ABSTRACT:
Apparatus for electrically interconnecting a focal plane array component of infrared detectors to a second focal plane array component of electronics, such as multiplexers. First and second interconnecting members are comprised of indium bumps wherein the bumps are of generally rectangular shape and of nonparallel orientation, typically crossing at 90.degree. angles. An alternative embodiment uses bumps of generally round shape wherein one of the bumps is of a smaller surface area than the other.

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F. Lavanant and J. L. Mathis, Chip-To-Terminal Interconnection Technique, vol. 14, No. 6, Nov. 1971, IBM Technical Disclosure Bulletin.

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