Electrical interconnection apparatus

Geometrical instruments

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H05K 108

Patent

active

042264928

ABSTRACT:
Electrical interconnection apparatus for mounting integrated circuit modules and for adapting the terminal pattern of the densely spaced leads of a module to the terminal pattern of the more widely spaced pin sockets of a printed wiring board. Rows of terminals (19, 20), spaced to conform to the module leads, are arranged on two sides of a module support platform (10) and are extended by conducting elements (27, 28, 29, 30) to particular terminal pins of a plurality of rows of terminal pins (21, 22, 23, 24, 25, 26) extending from the underside of lead frame blocks (11, 12) retained by the support platform (10). Ground plane elements (15, 16, 17, 18) are featured which are supported by the lead frame blocks (11, 12) between the terminal pin rows (21, 22, 23, 24, 25, 26) to control the impedance of the conducting elements (27, 28, 29, 30).

REFERENCES:
patent: 3353263 (1967-11-01), Helms
patent: 3409861 (1968-11-01), Barnes et al.
patent: 3497947 (1970-03-01), Ardezzone
patent: 3587029 (1971-06-01), Knowles
patent: 3617817 (1971-11-01), Kawakatsu
patent: 3781457 (1973-12-01), McKerreghan
patent: 3904262 (1975-09-01), Cutchaw
IBM Bulletin, Honn, vol. 15, No. 1, p. 308, 6-1972.
IBM Bulletin, Benenati, vol. 20, No. 6, p. 2221, 11-1977.

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