Electrical interconnect using particle enhanced joining of metal

Details Electrical interconnect using particle enhanced joining of metal Electrical interconnect using particle enhanced joining of metal

1995-04-12

1997-06-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156330, 174260, 228116, 438618, 438964, H01R 4300

Patent

active

056342659

ABSTRACT:
A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

REFERENCES:
patent: 4562104 (1985-12-01), Maeda
patent: 4804132 (1989-02-01), Difrancesco
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5083697 (1992-01-01), Difrancesco
patent: 5108950 (1992-04-01), Wakabayashi et al.

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