Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
1999-11-24
2001-04-24
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
C439S034000, C439S066000, C439S078000, C439S083000, C439S700000, C439S775000, C439S824000
Reexamination Certificate
active
06220876
ABSTRACT:
TECHNICAL FIELD
The present invention relates to bussed electrical distribution centers having bussed circuits and/or various electronic components and to printed circuit boards composed of a dielectric substrate having various side-mounted and stickleaded electronic components, and more particularly to an interconnect system for providing a direct connection therebetween.
BACKGROUND OF THE INVENTION
A bussed electrical distribution center (hereinafter referred to simply as a “BEDC”) is a stand-alone central junction block assembly which has gained increasing applications in the automotive arts as motor vehicles become ever more electronically sophisticated. BEDC's package, for example, various fuses, relays and electronic devices in a single central location. BEDCs not only save cost by consolidating electrical interconnections, but also advantageously reduce the number of cut and spliced leads, thereby increasing reliability.
A BEDC construction which is considered state of the art is described in U.S. Pat. No. 5,715,135, to Brussalis et al., dated Feb. 3, 1998, which is assigned to the assignee of the present invention, the disclosure of which is hereby incorporated by reference herein.
In the BEDC described in U.S. Pat. No. 5,715,135, a two-piece main insulation assembly is provided. Stamped male blade or tuning fork terminals are press-fit between the main insulation assembly, wherein the terminals are provided with a wire slot. The upper half of the main insulation assembly has a top surface provided with a plurality of terminal stations and guide stations that are raised and separated from each other so as to provide a network of channels that provide wire passages. The terminal stations have IDC (insulation displacement) type terminal slots that extend through the upper half of the main insulation assembly and allow a press-fit affixment of the terminals, wherein the wiring slots thereof intersect the wiring passages. The lower half of the main insulation assembly is configured similarly. When a segment of bus wire (preferably solid copper) is routed selectively along the wiring channels, the bus wire segment is pressed through the wire slot of a selected number of the terminals to thereby electrically connect those terminals therewith.
A printed circuit board (hereinafter simply referred to as a “PCB”), is a board-like, electrically interfaced package of electronic components which has become ubiquitous in the electrical arts. PCBs typically are in the form of a dielectric substrate (such as for example an organic resin reinforced by fibers) and a predetermined pattern of perforations for making connections with wiring and electrical devices, wherein a conductive path, usually cladded copper, is patterned so as to provide a predetermined electrical routing between the perforations so that the wiring and electrical devices are functionally interconnected.
Referring now to
FIG. 1
, a prior art interconnection system for electrically interfacing a BEDC with a PCB is depicted for an automotive environment of operation. In this automotive environment, a BEDC
10
is connected by a wiring harness
12
to a PCB
14
. At each connection of the wiring harness
12
, a connector
16
,
18
is required. Further, the connectors
16
,
18
must be enlarged, or additional connectors must be provided, in order to interface with separate wiring
20
,
22
that must communicate with various electrical components of the motor vehicle.
The prior art interconnection system of
FIG. 1
has several disadvantages, among these are: high cost of interface via a wiring harness; lower reliability due to use of numerous connectors; large volume of space allocated for the separate BEDC and PCB; and intensive assembly labor; limited flexibility in configuring the interconnection system; and susceptibility to weakened soldered connections. Accordingly, what remains needed in the art is a connection system for providing an integrated BEDC and PCB that is flexible, resistant t o electrical disconnection, and easy to make at low cost.
SUMMARY OF THE INVENTION
In accordance with the teachings of the present invention, an interconnect system and method are provided for directly connecting a printed circuit board to a bussed electrical distribution center. The system includes a bussed electrical distribution center having a main assembly and at least one bus wire. Also included is a printed circuit board having a substrate and a conductive path fabricated thereon. An electrical interconnect connects the at least one bus wire on the bussed electrical distribution center with the conductive path on the printed circuit board, and the interconnect has a flexible bend located between the bussed electrical distribution center and printed circuit board to provide a flexible strain relieved interconnection.
Accordingly, the interconnect system and method of the present invention provide for the connection of a PCB to a BEDC with enhanced reliability and requires minimal assembly labor. The present invention provides enhanced flexibility in the electrical connection to minimize the likelihood of electrical disconnection due to vibration or other adverse forces. The present invention further obviates the need for wiring harnesses, and provides minimized component volume.
These, and additional objects, advantages, features and benefits of the present invention will become apparent from the following specification.
REFERENCES:
patent: 3701984 (1972-10-01), Burns
patent: 3897126 (1975-07-01), Frances et al.
patent: 4689718 (1987-08-01), Maue et al.
patent: 5653607 (1997-08-01), Saka et al.
patent: 5715135 (1998-02-01), Brussalis et al.
patent: 5788529 (1998-08-01), Borzi et al.
patent: 5831814 (1998-11-01), Hamill
Avila Andres Eduardo
Carano Dominic
Gladd Joseph Howard
Hawes Kevin Joseph
Natoli Richard Alan
Delphi Technologies Inc.
Funke Jimmy L.
Nguyen Truc
Vu Hien
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