Electrical interconnect system

Geometrical instruments

Patent

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Details

339278C, 339 17E, 339 17F, 29860, H01R 1120

Patent

active

046471332

ABSTRACT:
A corrosion resistant electrical interconnect system has a flexible circuit with buried conductor patterns in an insulative film coating which is juxtaposed to a feed-through connector having inlet/outlet electrical contact pins therethrough. Sharp ends are present on the pins which pierce the insulative film and permit spot welding of the pin tips to portions of the conductor pattern. Other portions of the conductor pattern extend exteriorly of the flexible circuit and are electrically connected on to bond pads of an integrated circuit chip such as a sensor chip utilized in a mass flow meter.

REFERENCES:
patent: 3375323 (1968-03-01), Mayhew
patent: 3389461 (1968-06-01), Hardardt
patent: 3461552 (1969-08-01), Wolf et al.
patent: 3522652 (1969-08-01), Gordon
patent: 3573345 (1971-04-01), Devries et al.
patent: 3697925 (1972-10-01), Henschen
patent: 3818415 (1974-06-01), Evans et al.
patent: 4030799 (1977-06-01), Vanaleck
patent: 4260212 (1981-04-01), Ritchie et al.
patent: 4348263 (1982-09-01), Draper et al.
patent: 4417097 (1983-11-01), Das
patent: 4429349 (1984-01-01), Zachry
patent: 4458969 (1984-07-01), Demeo

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