Electrical interconnect structures for integrated circuits...

Details Electrical interconnect structures for integrated circuits... Electrical interconnect structures for integrated circuits...

2007-11-13

2007-11-13

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C228S110100

Reexamination Certificate

active

10552429

ABSTRACT:
Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

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