Electrical interconnect structures and processes

Details Electrical interconnect structures and processes Electrical interconnect structures and processes

1994-10-17

1996-10-22

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 33, 216 66, 216 67, 216 65, 505411, 505412, 505413, B44C 122, C03C 1500

Patent

active

055673309

ABSTRACT:
Electrical interconnect structures comprised of high temperature superconducting signal layers on a substrate bonded to one another or optionally to a base substructure containing power and ground planes and processes for their preparation are disclosed.

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