Electrical interconnect device with interwoven power and ground

Details Electrical interconnect device with interwoven power and ground Electrical interconnect device with interwoven power and ground

1992-09-02

1993-12-21

Donovan, Lincoln

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361738, 361748, 361803, 174255, 257698, H05K 114

Patent

active

052726002

ABSTRACT:
The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate the need for separate power and ground layers while providing decoupling capacitance within the wiring structure.

REFERENCES:
patent: 4072816 (1978-02-01), Gedney et al.
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4332778 (1982-03-01), Barbour et al.
patent: 4628411 (1986-12-01), Balderes et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4811076 (1989-03-01), Tigelaar et al.
patent: 4816323 (1989-03-01), Inoue
patent: 4816894 (1989-03-01), Hattori
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 5136471 (1992-08-01), Inasaka
patent: 5155302 (1992-10-01), Nguyen
patent: 5177594 (1993-01-01), Chance et al.
U.S. Ser. No. 07/605,806 filed Oct. 30, 1990.
U.S. Ser. No. 07/840,428 filed Feb. 24, 1992.
"Low-Cost Multichip Modules Push Limits of Packaging", Electronic Design International, Jul. 1990.
Anderson et al., "Surface Mount Design and Assembly for High Density Complex Modules," 6th Annual International Electronics Packaging Society Conference, San Diego, Calif, Nov. 17-19, 1986, pp. 404-416.

Affiliated with

Also associated with

Rating

Electrical interconnect device with interwoven power and ground does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical interconnect device with interwoven power and ground , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical interconnect device with interwoven power and ground will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-312786