Electrical interconnect device with customizeable surface layer

Details Electrical interconnect device with customizeable surface layer Electrical interconnect device with customizeable surface layer

1994-04-13

1996-08-06

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361803, H05K 111

Patent

active

055440185

ABSTRACT:
Provided is an electrical interconnect cell intermittently spaced across a substrate to form an interconnect device or structure. The interconnect device is fully customizable or programmable upon the upper surface to accommodate various electrical components and connectivity to those components. The electrical interconnect device includes a plurality of intermittently spaced first pairs of upper and lower signal lines interwoven with a plurality of intermittently spaced second pairs of upper and lower signal lines. A bonding pad is arranged between adjacent upper and lower signal line pairs and can be connected thereto with conductive links placed upon the surface layer. Each bonding pad includes one or more pad vias which extend perpendicular to the upper surface to conductive structures arranged in lower layers. Approximately one-half of the array of bonding pads are connected to potential conductors. The pairs of upper signal lines can not only be linked, but also can be cut to form a more direct routing between target locations. Moreover, the upper and lower signal lines are connected in order for traces to extend across the entire interconnect structure for ease of testability.

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Miracky, et al., "Laser Customization of a Multichip Module Substrate," IEEE, vol. 1, No. 3 (Sep. 1993) 387-389.
Burman, et al., "Programmable Multichip Modules," IEEE, (Apr. 1993) 28-35.
Raffel, "Programmable Technology for Rapid Prototyping," M.I.T. Lincoln Laboratory, (Feb. 14, 1994).

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