Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-01-03
2009-06-23
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S091000
Reexamination Certificate
active
07549870
ABSTRACT:
An electrical interconnect device includes a substrate having opposite outer surfaces and an array of conductive elastomeric columns held by the substrate. Each of the columns have opposite ends that extend beyond respective ones of the outer surfaces of the substrate. Conductive contact caps are disposed over the opposite ends of each said column. An electrical path is defined from one of the contact caps, through the conductive elastomeric column, to another of the contact caps. Optionally, the contact caps may be sized and shaped substantially similarly as the ends of the elastomeric columns. The contact caps may be adhered to the ends of the columns, or alternatively, the contact caps may be adhered to the substrate.
REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5007842 (1991-04-01), Deak et al.
patent: 5163834 (1992-11-01), Chapin et al.
patent: 5388997 (1995-02-01), Grange et al.
patent: 5599193 (1997-02-01), Crotzer
patent: 6056557 (2000-05-01), Crotzer et al.
patent: 6106305 (2000-08-01), Kozel et al.
patent: 6271482 (2001-08-01), Crotzer et al.
patent: 6764313 (2004-07-01), Hougham
patent: 6790057 (2004-09-01), DelPrete et al.
patent: 6939143 (2005-09-01), Rathburn
patent: 7070420 (2006-07-01), Wakefield et al.
patent: 7331796 (2008-02-01), Hougham et al.
patent: 2002/0127893 (2002-09-01), Brodsky
patent: 2003/0186572 (2003-10-01), Hougham et al.
patent: 2004/0110322 (2004-06-01), Hougham et al.
patent: 2006/0003648 (2006-01-01), Hougham et al.
patent: 2006/0009050 (2006-01-01), Hougham et al.
patent: WO 2004/039135 (2004-05-01), None
Alden, III Wayne Stewart
Chou George
Hilty Robert D.
MacPherson Edward
Mason Jeffery W.
Abrams Neil
Patel Harshad C
Tyco Electronics Corporation
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