Electrical interconnect and method for forming the same

Fishing – trapping – and vermin destroying

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437192, 437194, 437209, 205125, 205 83, 205170, 205224, 205226, 257779, 22818022, 427 58, 427123, 427125, 4273766, 427250, H01L 2144

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054808359

ABSTRACT:
A method for forming an electrical interconnect on a substrate. At least one pad (14) is formed on a substrate (11). The pad (14) is formed having a non-wetting surface (12) and a wettable surface (13). Photoresist (44) is patterned on a substrate (41) forming a cavity on a pad (46) leaving a non-wetting surface (42) and a wettable surface (43) exposed. Interconnect material (56) is formed on a non-wetting surface (52) and a wettable surface (53) of pad 57. Interconnect material (56) is reflowed forming an interconnect ball (74) on a wettable surface (73). Surface tension causes interconnect material (56) when reflowed to flow from a non-wetting surface (72) to the wettable surface (73) and ball up to form the interconnect ball (74).

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patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5194137 (1993-03-01), Moore et al.
patent: 5221038 (1993-06-01), Melton et al.
patent: 5230965 (1993-07-01), Cole, Jr. et al.
patent: 5352629 (1994-10-01), Paik et al.

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