Electrical insulation system based on poly(dicyclopentadiene)

Details Electrical insulation system based on poly(dicyclopentadiene) Electrical insulation system based on poly(dicyclopentadiene)

2011-07-19

2011-07-19

Zimmer, Marc S (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S424000, C524S425000, C524S430000, C524S444000, C524S493000, C524S497000, C524S553000, C524S554000, C524S462000, C524S463000

Reexamination Certificate

active

07981955

ABSTRACT:
Electrical insulation system, which optionally contains a filler material and/or further additives, wherein said electrical insulation system comprises poly(dicyclopentadiene) as the main component, and method of making said electrical insulation system.

REFERENCES:
patent: 4520181 (1985-05-01), Klosiewicz
patent: 4966928 (1990-10-01), Kitagawa et al.
patent: 5831108 (1998-11-01), Grubbs et al.
patent: 6001909 (1999-12-01), Setiabudi
patent: 6111121 (2000-08-01), Grubbs et al.
patent: 2003/0035992 (2003-02-01), Yoshida et al.
patent: 2004/0126557 (2004-07-01), Thiele et al.
patent: 1 244 192 (1988-11-01), None
patent: 0 283 719 (1988-09-01), None
patent: 1 535 941 (2005-06-01), None
patent: 61-296036 (1986-12-01), None
patent: 2000-327756 (2000-11-01), None
Form PCT/ISA/210 (International Search Report) dated Jan. 16, 2007.
Form PCT/ISA/237 (Written Opinion of the International Searching Authority) dated Jan. 16, 2007.
European Search Report dated Jan. 16, 2006.
Chemical Abstracts of JP 61-296036, Dec. 26, 1986, AN 107:97841, “Polycyclic Olefin Laminated Boards”, pp. 1-10, XP-002358979.
Chemical Abstracts of JP 2000-327756, Nov. 28, 2000, AN 2001-128684, “Polymerization Process for Ring Opening Norbornene and Dicyclopentadiene, Where a Polymerization Composition is Kept at a Predetermined Temperature, and Subjecting to Polymerization at a Predetermined Temperature Raising Speed”, pp. 1-22, XP-002358983.
M. R. Kessler et al., “Cure Kinetics of the Ring-Opening Metathesis Polymerization of Dicyclopentadiene”, Journal of Polymer Science, Part A, Polymer Chemistry, 2002, vol. 40, pp. 2373-2383.
International Preliminary Report on Patentability dated May 7, 2008.

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