Electrical fuse and semiconductor device

Details Electrical fuse and semiconductor device Electrical fuse and semiconductor device

2009-08-03

2011-11-08

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S209000, C257S665000, C257S767000, C257S775000, C257SE23149

Reexamination Certificate

active

08053863

ABSTRACT:
An electrical fuse comprises: an interconnect to be cut; and a first terminal and a second terminal which are respectively provided at both ends of the interconnect to be cut. The interconnect to be cut comprises: a first orientation film which contains copper as a main component and is oriented in a (111) plane; and a second orientation film which contains copper as a main component and is oriented in a (511) plane. The second orientation film is provided inside the first orientation film over a width direction of the first orientation film, which is perpendicular to a direction from the first terminal toward the second terminal, so as to partition the first orientation film. Accordingly, it becomes possible to securely cut the electrical fuse whose constituent material is copper, and moreover, to maintain a satisfactory cut state of the electrical fuse after the cutting.

REFERENCES:
patent: 2004/0262710 (2004-12-01), Ueda
patent: 2006/0263986 (2006-11-01), Mori et al.
patent: 2008/0169529 (2008-07-01), Kim et al.
patent: 2009/0051003 (2009-02-01), Cheng et al.
patent: 2009/0146251 (2009-06-01), Ueda
patent: 2009/0206446 (2009-08-01), Russ et al.
patent: 2001-68475 (2001-03-01), None
patent: 2004-304002 (2004-10-01), None
patent: 2005-39220 (2005-02-01), None

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