Electrical feedthroughs for ceramic circuit board support substr

Details Electrical feedthroughs for ceramic circuit board support substr Electrical feedthroughs for ceramic circuit board support substr

1995-01-27

1996-10-15

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428432, 428433, 428901, 428209, 174256, 174261, B32B 900

Patent

active

055652620

ABSTRACT:
Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

REFERENCES:
patent: 4563543 (1986-01-01), Kersuzan et al.
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5021287 (1991-06-01), Otagiri et al.
patent: 5232765 (1993-08-01), Yano et al.
patent: 5277724 (1994-01-01), Prabhu

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