Electrical feedthroughs for ceramic circuit board support substr

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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205164, 205195, 205221, 205224, 427 97, C25D 502, C25D 556, C25D 550, C25D 512

Patent

active

056814445

ABSTRACT:
Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

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