Electrical feedthrough structure and fabrication method

Batteries: thermoelectric and photoelectric – Photoelectric – Cells

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136262, 428901, 437 3, 437 4, 437 5, 437195, 437203, 437947, 427 97, 174266, H01L 3118

Patent

active

054258162

ABSTRACT:
In an electrical via structure and fabrication method that is particularly suited to coplanar contact solar cells, an initial opening (38,48a,48b,64) through the substrate is coated and substantially closed with a dielectric material (42,52,80). An inner opening (44) is then formed through the dielectric, and the via is provided with a conductive coating (46,54). The dielectric is initially applied in a liquid state and is thereafter cured to a solid. The need for strong chemical etchants to smooth the via opening prior to application of the dielectric and metallization is eliminated, and a polyimide dielectric on a GaAs/Ge solar cell has resulted in a substantial improvement in leakage resistance and cell efficiency.

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