Electrical devices employing a conductive epoxy resin formulatio

Details Electrical devices employing a conductive epoxy resin formulatio Electrical devices employing a conductive epoxy resin formulatio

1978-08-04

1980-07-01

Hess, Bruce H.

Stock material or miscellaneous articles

Composite

Of epoxy ether

156330, 252500, 252514, 260 37EP, 428195, 428201, 428204, 428208, 428328, B32B 714, B32B 2738, H01B 106

Patent

active

042107040

ABSTRACT:
A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.

REFERENCES:
patent: 3580776 (1971-05-01), Shenfil et al.
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3862260 (1975-01-01), Sellers et al.
patent: 4038742 (1977-08-01), Kimball et al.
patent: 4048188 (1977-09-01), Baker et al.

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