Electrical device with covering

Details Electrical device with covering Electrical device with covering

2007-04-02

2010-11-23

Williams, Hezron (Department: 2856)

Measuring and testing

Instrument casing

Reexamination Certificate

active

07836764

ABSTRACT:
The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

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patent: 2004/0238943 (2004-12-01), Fujii
patent: 2006/0169049 (2006-08-01), Matsubara
patent: 2008/0053254 (2008-03-01), Reichenbach et al.
patent: 10253652 (1998-09-01), None
patent: 2001044228 (2001-02-01), None

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