Electrical device having a bonded ceramic-copper heat transfer m

Details Electrical device having a bonded ceramic-copper heat transfer m Electrical device having a bonded ceramic-copper heat transfer m

1993-06-29

1994-10-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 257729, 338 51, 361713, H05K 720

Patent

active

053552814

ABSTRACT:
The present invention relates to an electrical device such as a resistor or silicon controlled rectifier that is provided with an improved heat transfer medium for transferring heat from the device to an adjacent structure such as a mounting panel. The improved heat transfer medium includes a bonded series of laminates including a layer of nickel-plated copper sandwiched between two layers of ceramic, such as aluminum oxide.

REFERENCES:
patent: 3955169 (1976-05-01), Kerfoot
patent: 4227036 (1980-10-01), Fitzgerald
patent: 4811166 (1989-03-01), Alvarez
patent: 4963414 (1990-10-01), LeVasseur
patent: 5022462 (1991-06-01), Flint
patent: 5179366 (1993-01-01), Wagner
patent: 5276423 (1994-01-01), Breit
patent: 5282111 (1994-01-01), Hopfer

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