Electrical device formed from polymeric heat resistant photopoly

Details Electrical device formed from polymeric heat resistant photopoly Electrical device formed from polymeric heat resistant photopoly

1981-12-24

1983-10-18

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

430 11, 430283, 430311, 430272, 430319, 430330, 428901, G03C 500

Patent

active

044106122

ABSTRACT:
An electrical device formed from a polymeric heat resistant photopolymerizable composition of a polyamide ester, resin containing photopolymerizable groups which forms a relief structures on electrical devices such as capacitors, integrated circuits, printed circuits, multilayer circuits or semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

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