Electrical device and method of making

Details Electrical device and method of making Electrical device and method of making

2005-11-29

2005-11-29

Thomas, Tom (Department: 2815)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C438S458000

Reexamination Certificate

active

06969667

ABSTRACT:
An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation condition. The deformation condition can be a predetermined pressure from opposing surfaces on the first and second substrates or it can be a predetermined combination of temperature and pressure from opposing surfaces on the first and second substrates.

REFERENCES:
patent: 6252229 (2001-06-01), Hays et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 2001/0022207 (2001-09-01), Hayes et al.
patent: 2002/0053735 (2002-05-01), Neuhaus et al.
patent: 2002/0119396 (2002-08-01), Jiang et al.

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