Electrical device allowing for increased device densities

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S769000, C361S779000

Reexamination Certificate

active

06909055

ABSTRACT:
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

REFERENCES:
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4635354 (1987-01-01), Chrobak et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4794446 (1988-12-01), Hamano
patent: 5067007 (1991-11-01), Otsuka et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5258577 (1993-11-01), Clements
patent: 5261156 (1993-11-01), Mase et al.
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5268331 (1993-12-01), Abbott
patent: 5268536 (1993-12-01), Kakehi
patent: 5281851 (1994-01-01), Mills et al.
patent: 5283947 (1994-02-01), Santo et al.
patent: 5296736 (1994-03-01), Frei et al.
patent: 5305179 (1994-04-01), Sono et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5469333 (1995-11-01), Ellerson et al.
patent: 5471097 (1995-11-01), Shibata
patent: 5491362 (1996-02-01), Hamzedoost et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5525547 (1996-06-01), Matsunaga et al.
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5622590 (1997-04-01), Kunitomo et al.
patent: 5687474 (1997-11-01), Hamzedoost et al.
patent: 5697148 (1997-12-01), Lance, Jr. et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 5786985 (1998-07-01), Taniguchi et al.
patent: 5843251 (1998-12-01), Tsukagoshi et al.
patent: 5874780 (1999-02-01), Murakami
patent: 6046910 (2000-04-01), Ghaem et al.
patent: 6151221 (2000-11-01), Van Lerberghe
patent: 6172422 (2001-01-01), Chigawa et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6320247 (2001-11-01), Sakamoto
patent: 6528867 (2003-03-01), Ahmad
Engineering-in-Training Reference Manual (7th edition, 1990) by Michael R. Lindeburg, P.E.. p. 36-6, section 10.
Data Sheet for “HYSOL FP4323”.
George Odian, “Principles of Polymerization” (3d ed. 1991), p. 29, 31, 32, 34.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrical device allowing for increased device densities does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical device allowing for increased device densities, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical device allowing for increased device densities will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3499959

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.