Electrical coupling of substrates by conductive buttons

Details Electrical coupling of substrates by conductive buttons Electrical coupling of substrates by conductive buttons

2005-02-01

2005-02-01

Gushi, Ross (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06848914

ABSTRACT:
A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

REFERENCES:
patent: 4090768 (1978-05-01), Tregoning
patent: 5427535 (1995-06-01), Sinclair
patent: 5540594 (1996-07-01), Collins et al.
patent: 5567179 (1996-10-01), Voltz
patent: 6059579 (2000-05-01), Kresge et al.
patent: 6062879 (2000-05-01), Beaman et al.
patent: 6080936 (2000-06-01), Yamasaki et al.
patent: 6224396 (2001-05-01), Chan et al.
patent: 6264476 (2001-07-01), Li et al.

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