Electrical contacts in microelectromechanical devices with...

Details Electrical contacts in microelectromechanical devices with... Electrical contacts in microelectromechanical devices with...

2006-09-19

2006-09-19

Ben, Loha (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S291000, C359S298000

Reexamination Certificate

active

07110160

ABSTRACT:
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.

REFERENCES:
patent: 4935086 (1990-06-01), Baker et al.
patent: 5835256 (1998-11-01), Huibers
patent: 5999306 (1999-12-01), Atobe et al.
patent: 6046840 (2000-04-01), Huibers
patent: 6396619 (2002-05-01), Huibers et al.
patent: 6523961 (2003-02-01), Ilkov et al.
patent: 6529310 (2003-03-01), Huibers et al.
patent: 6731420 (2004-05-01), Orcutt et al.
patent: 6844959 (2005-01-01), Huibers et al.
patent: 6873450 (2005-03-01), Patel et al.
patent: 6885494 (2005-04-01), Patel et al.
patent: 2004/0145089 (2004-07-01), Burrows
patent: 2005/0231792 (2005-10-01), Alain et al.
Klosterman, et al, Materials Characterization, Conduction Development, and Curing Effects on Realiability of Isotropically Conductive Adhesives, 1998 IEEE, pp. 23-31.
John Gould, TechnologyWatch Mini Briefing, Polymer Electronics, 2004, pp. 1-6.

Affiliated with

Also associated with

Rating

Electrical contacts in microelectromechanical devices with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical contacts in microelectromechanical devices with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical contacts in microelectromechanical devices with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3619861