Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-03-08
2001-06-12
Sircus, Brian (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S070000
Reexamination Certificate
active
06244874
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to electrical interconnections in general. In particular, it relates to the interconnection of the leads of an integrated circuit device with a printed circuit board used in performance testing.
BACKGROUND OF THE INVENTION
Many designs for effecting the interconnection between leads of an integrated circuit (IC) device and a printed circuit board have been described for performance evaluation of the IC device. In particular, U. S. Pat. No. 5,207,584 discloses an electrical interconnect contact system having a housing with generally z or s-shaped planar contacts. Troughs are provided along the two surfaces of the housing with securing elements seated inside the troughs. The s-shaped contacts are mounted in slots cut across the housing, with the two hooks of the s-shape each engaging one securing element, and the two ends of the contacts exposed one on each surface. The leads of the IC device for testing would be in contact with s-shaped contact from one surface, and a pad or terminal of a printed circuit board in contact with the s-shaped contact or probe from the other surface. At least one of the securing elements is elastomeric to facilitate a wiping action by which contact with the lead of the IC and the pad of the printed circuit board are effected. This wiping action, although providing effective contact during initial use, has been found to cause an unacceptably high rate of wearing of the connecting pad on the printed circuit board. Since the printed circuit board is very costly, it is not economically viable to change the board frequently. In addition, because the elastomeric elements such as elastomeric bands used to allow this wiping action has to be of sufficient laxity to allow lateral movement to effect wiping, they wear out quickly, requiring time-consuming and costly replacements. There is therefore a need to design a new electrical contact to overcome the problems stated above.
OBJECT OF THE INVENTION
It is one object of the present invention to provide an electrical contact which produces reduced wearing when used with an electrical interconnect contact system.
It is another object to provide an electrical contact which allow reliable electrical connection.
SUMMARY OF THE INVENTION
The present invention is an novel electrical contact for IC device testing. This electrical contact provides good contact with the lead of a test IC device without involving wiping action. This electrical contact comprises a first and second arm formed into a generally C-shaped segment and a hook segment which protrudes from the C-shape segment in a direction generally opposite the second arm. The first and the second arms are connected via a resilient neck. The preferred embodiment is a planar metallic pin having the general shape of the Greek alphabet Tau (&tgr;), and is adapted for use with an apparatus for electrically interconnecting a lead of a test device to a terminal spaced at a distanced from the lead. The apparatus has a housing interposed between the lead and the terminal, with at least one contact receiving slot formed therein. This slot extends substantially parallel to an axis extending between a corresponding lead and a terminal. The housing also comprises oppositely facing first and second surfaces. The first surface proximate the lead, and the second surface proximate the terminal. The second surface having a trough formed therein proximate the terminal. A resilient element is received in the trough. The contact according to the preferred embodiment is received in the slot with the first arm protruding from the first surface, and adapted for effective contact with the test lead. The second arm protrudes from the second surface and is adapted for contact with the terminal. The hook segment protrudes from said C-shape segment in a direction generally opposite the second arm, and is adapted to receive the securing element such that the hook segment is pressed into contact with the terminal, such that testing the IC device is accomplished without wiping action.
REFERENCES:
patent: 4494807 (1985-01-01), Cosmo
patent: 5069629 (1991-12-01), Johnson
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5207584 (1993-05-01), Johnson
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5594355 (1997-01-01), Ludwig
patent: 5634801 (1997-06-01), Johnson
patent: 5749738 (1998-05-01), Johnson et al.
Carroll Michael E.
Gibbons Jon A.
Lawrence Y. D. Ho & Associates
Sircus Brian
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