Electrical contact materials

Details Electrical contact materials Electrical contact materials

1982-01-18

1985-03-05

Smith, John D.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 384, 427 58, 427 98, 427438, 200266, 200268, 200269, 428675, 428680, 428926, 428929, 428936, C23C 302, H01H 102

Patent

active

045031312

ABSTRACT:
Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.

REFERENCES:
patent: 3162512 (1964-12-01), Robinson
patent: 4232060 (1980-11-01), Mallory
patent: 4349585 (1982-09-01), Nagashima
Haddad et al., "Technique . . . ", IBM Corp., 1978, IBM TDB, vol. 21, No. 6, Nov. 1978, p. 2316.

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