Electrical contact for ball grid array socket

Details Electrical contact for ball grid array socket Electrical contact for ball grid array socket

1998-12-28

2000-12-05

Luebke, Renee

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439 78, H01R 1200

Patent

active

061558451

ABSTRACT:
An electrical contact for use with a BGA socket comprises an engaging section and a connecting section attached thereto. The connecting section comprises a circular solder plate attached directly below an elongate body of the engaging section thereby providing the contact with increased durability. The engaging section is inserted into the corresponding passageway of the housing from a bottom surface thereof whereby the circular solder plate effectively covers an opening of the passageway. Flux is applied to the solder plates of the contacts by means of a screening process and the contacts will not deform under pressure of a squeegee. A solder ball is attached to the solder plate and positioning mechanism ensures that the solder ball adheres to a central portion thereof.

REFERENCES:
patent: 5489218 (1996-02-01), McHugh
patent: 5562474 (1996-10-01), Lee
patent: 5632629 (1997-05-01), Legrady
patent: 5909011 (1999-07-01), Chartrand et al.
patent: 5934951 (1999-08-01), Lai et al.
patent: 5947778 (1999-09-01), Lai et al.

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