Electrical contact component, coaxial connector, and...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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C439S581000, C439S876000, C439S944000, C428S680000, C428S672000

Reexamination Certificate

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07632112

ABSTRACT:
An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.

REFERENCES:
patent: 5453017 (1995-09-01), Belopolsky
patent: 6261136 (2001-07-01), Dennis
patent: 6399475 (2002-06-01), Petit
patent: 6554630 (2003-04-01), Uratani
patent: 6556608 (2003-04-01), Gilliland et al.
patent: 7377795 (2008-05-01), Vicich et al.
patent: 2004/0079791 (2004-04-01), Kida et al.
patent: 2008/0293297 (2008-11-01), Wakamatsu et al.
patent: 62-199794 (1987-09-01), None
patent: 62-199795 (1987-09-01), None
patent: 04-162460 (1992-06-01), None
patent: 08-213070 (1996-08-01), None
patent: 09-172124 (1997-06-01), None
patent: 09-330629 (1997-12-01), None
patent: 10-084065 (1998-03-01), None
patent: 10-247535 (1998-09-01), None
patent: 2000-087293 (2000-03-01), None
patent: 2000-313986 (2000-11-01), None
patent: 2000-313992 (2000-11-01), None
patent: 2001-176612 (2001-06-01), None
patent: 2002-203627 (2002-07-01), None
patent: 2003-178844 (2003-06-01), None
patent: 3096377 (2003-06-01), None
patent: 2004-047827 (2004-02-01), None
Yamamoto et al.; “Reactivity to Form Intermetallic Compounds in the Micro Joint Using Sn-Ag Solder”; MES2003; Oct. 2003; pp. 45-48.
Kobayashi et al.; “Rapid Alloying in the Micro Joints Between Sn-Ag Solder and Au/Ni-Co Plating”; MES2004; Oct. 2004; pp. 233-236.
International Search Report issued in the corresponding International Application No. PCT/JP2005/021817, mailed on Dec. 12, 2005.
Official communication issued in counterpart Japanese Application No. 2006-547912, mailed on Nov. 18, 2008.

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