Electrical contact assembly for use in a multi-die encapsulation

Details Electrical contact assembly for use in a multi-die encapsulation Electrical contact assembly for use in a multi-die encapsulation

1998-02-20

1999-06-08

Reichard, Dean A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

439 69, H01R 909

Patent

active

059106409

ABSTRACT:
A multi-die encapsulation device has a plurality of die chambers. Each of the die chambers has parallel opposing walls, retaining edges which define an insertion void, and a retaining contact in contact with a printed circuit board. Each of the retaining contacts is characterized as having a compliant foot for making contact with a printed circuit board. The encapsulation device comprises a cap with a compression pad for protecting and biasing each of the bare die in its respective chamber.

REFERENCES:
patent: 3500131 (1970-03-01), Seeley
patent: 3648113 (1972-03-01), Rathjen et al.
patent: 3760486 (1973-09-01), Rifkin et al.
patent: 3812402 (1974-05-01), Garth
patent: 3829817 (1974-08-01), Beavitt
patent: 4328530 (1982-05-01), Bajorek et al.
patent: 4502100 (1985-02-01), Greenspan et al.
patent: 4645279 (1987-02-01), Grabbe et al.
patent: 4873615 (1989-10-01), Grabbe
patent: 4923404 (1990-05-01), Redmond et al.
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 4933808 (1990-06-01), Horton et al.
patent: 5015191 (1991-05-01), Grabbe et al.
patent: 5104324 (1992-04-01), Grabbe
patent: 5142449 (1992-08-01), Littlebury et al.
patent: 5243757 (1993-09-01), Grabbe et al.
patent: 5528466 (1996-06-01), Lim et al.
patent: 5767443 (1998-06-01), Farnworth et al.
"AMP Product Specification", PIB 65559, AMP Inc., Harrisburg, PA 17105, (Issued Jan. 1993).

Affiliated with

Also associated with

Rating

Electrical contact assembly for use in a multi-die encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical contact assembly for use in a multi-die encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical contact assembly for use in a multi-die encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1684374