Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-04-18
2001-05-15
Patel, Tulsidas (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000
Reexamination Certificate
active
06231353
ABSTRACT:
FIELD OF THE INVENTION
The present invention is directed to a solderless connector with multiple modes of compliance providing an initial insertion force differing from the secondary insertion force, and more particularly, to a connector having multiple compliant members that can be independently adjusted.
BACKGROUND OF THE INVENTION
The current trend in connector design for those connectors utilized in the computer field is to provide both high density and high reliability connectors between various circuit devices. High reliability for such connections is essential due to potential system failure caused by misconnections of devices. Further, to assure effective repair, upgrade, testing and/or replacement of various components, such as connectors, cards, chips, boards, and modules, it is highly desirable that such connections be separable and reconnectable in the final product.
Pin-type connectors soldered into plated through holes or vias are among the most commonly used in the industry today. Pins on the connector body are inserted through plated holes or vias on a printed circuit board and soldered in place using conventional means. Another connector or a packaged semiconductor device is then inserted and retained by the connector body by mechanical interference or friction. The tin lead alloy solder and associated chemicals used throughout the process of soldering these connectors to the printed circuit board have come under increased scrutiny due to their environmental impact. The plastic housings of these connectors undergo a significant amount of thermal activity during the soldering process, which stresses the component and threatens reliability.
The soldered contacts on the connector body are typically the means of supporting the device being interfaced by the connector and are subject to fatigue, stress deformation, solder bridging, and co-planarity errors, potentially causing premature failure or loss of continuity. In particular, as the mating connector or semiconductor device is inserted and removed from the present connector, the elastic limit on the contacts soldered to the circuit board may be exceeded causing a loss of continuity. These connectors are typically not reliable for more than a few insertions and removals of devices. These devices also have a relatively long electrical length that can degrade system performance, especially for high frequency or low power components. The pitch or separation between adjacent device leads that can be produced using these connectors is also limited due to the risk of shorting.
Another electrical interconnection method is known as wire bonding, which involves the mechanical or thermal compression of a soft metal wire, such as gold, from one circuit to another. Such bonding, however, does not lend itself readily to high density connections because of possible wire breakage and accompanying mechanical difficulties in wire handling.
An alternate electrical interconnection technique involves placement of solder balls or the like between respective circuit elements. The solder is reflowed to form the electrical interconnection. While this technique has proven successful in providing high density interconnections for various structures, this technique does not allow facile separation and subsequent reconnection of the circuit members.
An elastomer having a plurality of conductive paths has also been used as an interconnection device. The conductive elements embedded in the elastomeric sheet provide an electrical connection between two opposing terminals brought into contact with the elastomeric sheet. The elastomeric material that supports the conductive elements compresses during usage to allow some movement of the conductive elements. Such elastomeric connectors require a relatively high force per contact to achieve adequate electrical connection, exacerbating non-planarity between mating surfaces. Location of the conductive elements is generally not controllable. Elastomeric connectors may also exhibit a relatively high electrical resistance through the interconnection between the associated circuit elements. The interconnection with the circuit elements can be sensitive to dust, debris, oxidation, temperature fluctuations, vibration, and other environmental elements that may adversely affect the connection.
It is believed that a high density, repeatable, solderless, electrical connector that is tolerant to dust, debris, thermal and vibrational effect, and relatively easy to manufacture would constitute a significant advance in the art.
BRIEF SUMMARY OF THE INVENTION
The present invention is directed to a solderless connector with multiple modes of compliance providing an initial insertion force differing from the secondary insertion force. The connector has multiple compliant members that can be independently adjusted to accommodate a wide range of circuit members. The present connector allows the contact members to be arranged with a fine pitch without shorting. The multiple compliant members accommodate a wide range of thermal and vibrational effects, and can be configured to accommodate a wide range of compression distances.
The connectors of the present invention may be used for electrically connecting first and second circuit members. Each circuit member has first and second operative surfaces with connector members, respectively.
In a first embodiment, an electrically insulative connector housing is positioned substantially between the first and second circuit members. A resilient contact member is positioned generally within the connector housing. The contact member has resilient first and second circuit interface portions. The resilient contact member comprises a first compliant member. At least one end stop is provided for engaging with the contact member in a second mode of compliance. A resilient, dielectric encapsulating material surrounds a portion of the resilient contact member. The encapsulating material comprises a second compliant member, such that the first and second compliant members are capable of providing a first mode of compliance.
Elastic deformation of the resilient encapsulating material and the contact member comprises the first mode of compliance. Deformation of the contact member during the first mode of compliance is typically minimal. Elastic deformation of the contact member in response to engagement with an end stop comprises the second mode of compliance.
At least one support member may be provided for supporting the contact member. In one embodiment, the support member comprises a pivot point around which the contact member rotates. The support member may also comprises a flexible filament capable of permitting translational and/or rotational movement of the contact member.
A template having a plurality of slots may be provided for maintaining a preferred spacing between the contact members. The housing preferably has an opening extending between first and second surfaces for receiving the resilient contact. The first and second circuit interface portions of the resilient contact member extend above or below a first surface of the housing.
The second mode of compliance at the first circuit interface portion may be less than, greater than, or equal to the second mode of compliance at the second circuit interface portion. The first and second modes of compliance are preferably within the elastic limits of the contact member.
The connector provides an initial insertion force and a secondary insertion force with the circuit member. The initial insertion force may be less than, greater than, or equal to the secondary insertion force. First and second end stops may be provided on the housing for engaging with the contact member to initiate the second mode of compliance. The first and second circuit interface portions preferably provide a wiping engagement with an opposing connector member.
The resilient contact member may be of a variety of shapes, such as curvilinear, flat, concave, convex, pointed, or a shape complementary to a shape of the connector member. The resilient contact member
Faegre & Benson LLP
Gryphics, Inc.
Patel Tulsidas
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