Electrical connector with improved solder pads

Electrical connectors – With supporting means for coupling part – Flange on coupling part

Reexamination Certificate

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Reexamination Certificate

active

06231386

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the invention
The present invention relates to a connector, and particularly to a connector having a pair of improved solder pads for mounting the connector onto a circuit board by soldering the solder pads onto the circuit board by surface mounting technology (hereafter, SMT).
2. Description of the Prior Art
U.S. Pat. No. 5,186,654 discloses a conventional electrical connector
60
which is shown in FIG.
4
. The connector
60
comprises an insulative housing
61
, a plurality of contacts
62
received in the housing
61
and a pair of solder pads
63
for retaining the housing
61
together with the contacts
62
onto a circuit board
80
by soldering the solder pads
63
to the circuit board
80
by SMT. The housing
61
defines a pair of L-shaped channels
611
in two opposite lateral sides and communicating to a bottom side of the housing
61
. Each solder pad
63
generally has a U-shape comprising a horizontal retention portion
631
and a horizontal mounting portion
633
connecting with each other via a vertical portion
632
. The retention portion
631
is received in a horizontal section of the L-shaped channel
611
and the mounting portion
632
exposes beyond the L-shaped channel
611
to be soldered onto the circuit board
80
thereby retaining the housing
61
together with the contacts
62
onto the circuit board
80
. The solder pad
63
has a simple configuration and can be manufactured at a low cost. The present invention discloses another configuration of such a solder pad that can be manufactured at a low cost, too.
BRIEF SUMMARY OF THE INVENTION
An object of the present invention is to provide an electrical connector having a pair of low costly manufactured solder pads for mounting the electrical connector onto a circuit board.
To fulfil the above object, an electrical connector of the present invention comprises an insulative housing, a pair of contacts and a pair of L-shaped solder pads received in the insulative housing, respectively. The housing defines a pair of T-shaped channels spaced from each other in a bottom portion thereof. Each T-shaped channel comprises a groove and a recess laterally exposing to the groove. Each L-shaped solder pad comprises a first portion and a second portion being generally perpendicular to each other. A protrusion is embossed in a surface of the first portion of each solder pad. The first portions are assembled in the pair of T-shaped channels, respectively, and the protrusions are assembled in the pair of recesses, respectively. The second portions of the pair of L-shaped solder pads are soldered onto a circuit board, thereby retaining the electrical connector to the circuit board.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5096440 (1992-03-01), Katsumata
patent: 5186654 (1993-02-01), Enomoto et al.
patent: 5194017 (1993-03-01), Consoli
patent: 5232379 (1993-08-01), Lai
patent: 5297966 (1994-03-01), Brennian, Jr. et al.
patent: 5385478 (1995-01-01), Kiekawa
patent: 5591047 (1997-01-01), Yamada et al.
patent: 5704807 (1998-01-01), Sherman et al.
patent: 6007352 (1999-12-01), Azuma et al.
patent: 6012949 (2000-01-01), Lok

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