Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2011-07-12
2011-07-12
Le, Thanh-Tam T (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S607110
Reexamination Certificate
active
07976318
ABSTRACT:
High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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European Search Report, European Application No. EP09178085, European Filing Date Apr. 12, 2009.
Office Action for U.S. Appl. No. 12/474,587, mailed Dec. 3, 2009, 7 pgs.
Fedder James L.
Glover Douglas W.
Helster David W.
Knaub John E.
Minnick Timothy R.
Le Thanh-Tam T
Tyco Electronics Corporation
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