Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-03-08
2009-10-27
Lam, Cathy (Department: 1794)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S780000, C257S781000, C428S209000
Reexamination Certificate
active
07608929
ABSTRACT:
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second resist layer thereon, so as to form electrical connection pads and metal bumps on the electrical connection pads. The first and second resist layers are formed with openings therein at positions corresponding to the electrical connection pads and metal bumps, and the exposed conductive layer is removed. An adhesive layer is formed to cover the exposed surfaces of the electrical connection pads and the metal bumps. Then, the second resist layer, the first resist layer and the conductive layer covered by the first resist layer are removed. Later, an insulating protective layer is formed on a surface of the circuit board, and thinned to expose a portion of the adhesive layer, such that electrical connectors of the circuit board are fabricated.
REFERENCES:
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 5869899 (1999-02-01), Arledge et al.
patent: 6198169 (2001-03-01), Kobayashi et al.
patent: 7151050 (2006-12-01), Hsu et al.
Lam Cathy
Phoenix Precision Technology Corporation
Sawyer Law Group P.C.
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