Electrical connector semiconductor package with fly-over...

Details Electrical connector semiconductor package with fly-over... Electrical connector semiconductor package with fly-over...

2006-01-10

2006-01-10

Abrams, Neil (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Within distinct housing spaced from panel circuit arrangement

Reexamination Certificate

active

06984132

ABSTRACT:
An electrical connector semiconductor package with electrically conductive “fly-over” paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with “fly-over” paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with “fly-over” paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.

REFERENCES:
patent: 4392701 (1983-07-01), Weidler
patent: 5026293 (1991-06-01), Wilson
patent: 6176743 (2001-01-01), Kuo
patent: 6343957 (2002-02-01), Kuo et al.

Affiliated with

Also associated with

Rating

Electrical connector semiconductor package with fly-over... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical connector semiconductor package with fly-over..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connector semiconductor package with fly-over... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3524882