Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-04-22
1994-09-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
053464010
ABSTRACT:
An electrical connector (100) for translating from a first plurality of interconnects (108) formed at a first pitch to a second plurality of interconnects (125) formed at a second pitch smaller than the first pitch comprises a first heat seal connector (105), which includes the first plurality of interconnects (108), and a second heat seal connector (120), which includes the second plurality of interconnects (125). The electrical connector (100) further comprises a translation circuit (110), which includes a first set of outer terminals (115) formed at the first pitch, wherein the first set of outer terminals (115) is aligned with and electrically coupled to the first plurality of interconnects (108). The translation circuit (110) further includes a second set of outer terminals (548) formed at the second pitch, wherein the second set of outer terminals (548) is aligned with and electrically coupled to the second plurality of interconnects (125). Connection circuitry (510-545) electrically couples the first and second sets of outer terminals (115, 548).
REFERENCES:
patent: 3597660 (1971-08-01), Jensen
patent: 4993954 (1991-02-01), Prevost
IBM Technical Disclosure, Johnson, vol. 21, No. 6, p. 2320, Nov. 1978.
Davis Cindy L.
Delianides John
Abrams Neil
Berry Thomas G.
Gardner Kelly A.
Motorola Inc.
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