Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-08-18
1996-07-23
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439608, 174 35R, 174266, 333247, 361794, 257691, H01R 2376
Patent
active
055384331
ABSTRACT:
A PGA connector for a microprocessor has a multilayer base board assembly with alternating conductive and dielectric layers of preselected thicknesses through which signal pins, current source pins and a grounding pin extend. The signal pins are insulated from the conductive layers and the current and grounding pin are connected to preselected conductive layers. A series of connecting apertures formed by holes with respective conductive linings extend through the layers at selected locations between pins to interconnect selected conductive layers. The connecting apertures interconnect all conductive layers of the base board or, in another example, alternately positioned connecting apertures interconnect only respective different sets of alternately positioned conductive layers of the base board enabling improved shielding and impedance regulation and matching.
REFERENCES:
patent: 4498122 (1985-02-01), Rainal
patent: 4821007 (1989-04-01), Fields et al.
patent: 5102352 (1992-04-01), Arisaka
patent: 5191174 (1993-03-01), Chang et al.
patent: 5213521 (1993-05-01), Arisaka
KEL Corporation
Paumen Gary F.
Usher Robert W. J.
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