Electrical connector assembly with interleaved multilayer struct

Details Electrical connector assembly with interleaved multilayer struct Electrical connector assembly with interleaved multilayer struct

1997-04-17

1998-04-21

Paumen, Gary F.

Electrical connectors

Adapted to cooperate with duplicate connector

439493, 439717, 439 67, H01R 1328

Patent

active

057411484

ABSTRACT:
An electrical connector assembly having an interleaved multilayer structure includes a first connector structure having at least a first connector layer, and a second connector structure having at least second and third connector layers. A plurality of conductive contact surfaces are disposed along edge portions of the connector layers. Upon engagement of the first connector structure and the second connector structure, the first connector layer is oriented to engage a gap defined between the second and third connector layers. The interleaved engagement of the connector layers results in an low-profile electrical connector assembly providing a large number of interconnections between respectively aligned contact surfaces with precise alignment and reliable electrical contact. The connector layers may include conductive contact surfaces on one or both sides of each layer to provide higher interconnection densities. The disposition of contact surfaces on both sides of a layer can relax alignment tolerances for a given interconnection density. Nevertheless, precise alignment can be ensured by the use of conventional lithographic techniques to print the contact surfaces. At least some of the connector layers can be made from a material capable of resilient deformation, and can be realized, for example, by flexible printed circuit board layers or flex circuit layers. The resiliently deformable material, when deformed, produces a force that resists deformation. Thus, when interleaved engagement of the connector layers produces deformation, the resisting force serves to bias the connector layers against one another to ensure good electrical contact force.

REFERENCES:
patent: 1917009 (1933-07-01), Betts et al.
patent: 2961629 (1960-11-01), Kamm
patent: 3221286 (1965-11-01), Fedde
patent: 3601759 (1971-08-01), Barker
patent: 4116516 (1978-09-01), Griffin
patent: 4184729 (1980-01-01), Parks et al.
patent: 4227767 (1980-10-01), Mouissie
patent: 4411633 (1983-10-01), Waldron
patent: 4509098 (1985-04-01), DasGupta et al.
patent: 4892487 (1990-01-01), Dranchak et al.
patent: 4971575 (1990-11-01), Martellotti
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5074797 (1991-12-01), Yamada
patent: 5117282 (1992-05-01), Salatino
patent: 5123851 (1992-06-01), Young et al.
patent: 5145381 (1992-09-01), Volz
patent: 5176530 (1993-01-01), Reylek et al.
patent: 5206463 (1993-04-01), DeMaso et al.
patent: 5219292 (1993-06-01), Dickirson et al.
patent: 5228192 (1993-07-01), Salatino
patent: 5240420 (1993-08-01), Roberts
patent: 5315239 (1994-05-01), Vitriol
patent: 5322447 (1994-06-01), Okada
patent: 5328376 (1994-07-01), West
patent: 5334029 (1994-08-01), Akkapeddi et al.
patent: 5336117 (1994-08-01), Mizuguchi et al.
patent: 5345364 (1994-09-01), Biernath
patent: 5383788 (1995-01-01), Spencer
patent: 5386085 (1995-01-01), Miehls et al.
patent: 5421738 (1995-06-01), Roberts
patent: 5433632 (1995-07-01), Cherney et al.
IBM Corp., "Cable Connector", IBM Technical Disclosure Bulletin, vol. 28, #11, Apr. 1986, pp. 4989-4990.
IBM Corp., "Double Contact Connector", Shea, J.J., IBM Technical Disclosure Bulletin, vol. 9, No. 2, Jul. 1966, p. 148.
IBM Corp., "Microcircuit Module and Connector", Franck, D.R. and Hill, C.P., IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. 1970, pp. 1786-1787.
IBM Corp., "Printed Circuit Connector", Dunman, J.P.G., IBM Technical Disclosure Bulletin, vol. 7, No. 3, Aug. 1964, p. 182.
IBM Corp., "Circuit Board Assembly", Rice, R. and Shea, J.J., IBM Technical Disclosure Bulletin, vol. 4, No. 9, Feb. 1962, p. 7.
Military Specification, "Sheet, Printed Wiring Board General Specification For" MIL-S-13949H, Dec. 24, 1992.

Affiliated with

Also associated with

Rating

Electrical connector assembly with interleaved multilayer struct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical connector assembly with interleaved multilayer struct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connector assembly with interleaved multilayer struct will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2053226