Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Patent
1998-04-08
2000-03-07
Luebke, Renee S.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
439736, H01R 909, H01R 100
Patent
active
060332379
ABSTRACT:
The present invention provides a waterproof electrical connector assembly which is molded in two separate processes. Pluralities of respective projections 42, 48 protrude from surfaces 45, 46 of an inner housing 44 which has contacts 20, 30 so that a contact assembly 40 is formed. Contact assembly 40 is placed in a mold and positioned so that the tip ends of the projections 42, 48 substantially engage inside surfaces of the mold; afterward, an outer housing is molded to a thickness which is substantially the same as the height of the projections 42, 48.
REFERENCES:
patent: 4405192 (1983-09-01), Eaby et al.
patent: 4959018 (1990-09-01), Yamamoto et al.
patent: 5040097 (1991-08-01), Stribel
patent: 5067905 (1991-11-01), Matsumoto et al.
patent: 5207587 (1993-05-01), Hamill et al.
patent: 5703754 (1997-12-01), Hinze
patent: 5749739 (1998-05-01), Saka et al.
patent: 5764487 (1998-06-01), Natsume
patent: 5872333 (1999-02-01), Uezono et al.
Japanese Patent Publication No. 6-16423 (JP-B-6-16423) Filed by Fujitsu Ltd.--Apr. 23, 1987 and Published--Mar. 2, 1994. Entitled--"Connector".
Kohno Toshiaki
Sai Noriaki
Luebke Renee S.
Prasad Chandrika
The Whitaker Corporation
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