Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-10-04
1995-02-07
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439511, 439608, H01R 909
Patent
active
053871111
ABSTRACT:
A low-profile, high density, electrical connector (10), includes multiple layers (19, 22) of substantially parallel electrical conductors (31), the electrical conductors (25) each having a planar portion (29), and spaced ends (31) angling away from the planar portions (29). The planar portions (29) of the electrical conductors (25) are insulated with an insulating material (34). The spaced ends (31) of the electrical conductors (25) on each layer form a row of connector pins (13, 16). The connector (10) is formed by attaching the multiple layers (19, 22) along the insulated planar portions (29) of the conductors (25) to form a substantially rigid, low profile, multilayered structure.
REFERENCES:
patent: 3601755 (1971-08-01), Shields, Jr.
patent: 3721944 (1973-03-01), Weidler
patent: 4090667 (1978-05-01), Crimmins
patent: 4781620 (1988-11-01), Tengler et al.
patent: 4914062 (1990-04-01), Voltz
patent: 5257941 (1993-11-01), Lewee et al.
Thomas & Betts Article "High Performance Flexible Interconnects" pp. 2A-6A, 1992.
DeSantis John A.
Everest, III David C.
Jaramillo Giovanni
Bradley P. Austin
Elpel Jeanne M.
Fuller Andrew S.
Motorola Inc.
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