Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-08-23
2005-08-23
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S331000
Reexamination Certificate
active
06932622
ABSTRACT:
A land grid array connector (1) for electrically connecting a CPU package (3) to a printed circuit board includes a housing (2) and a number of contacts received in passageways (284) of the housing. The housing has a bottom wall (28) and sidewalls (22,24,26). The bottom wall and the sidewalls cooperatively define a receiving space (20) for accommodating the package therein. Protrusion member (228) is formed on the sidewalls and extends inwardly into the receiving space. A through hole (280) below the protrusion member is defined in the bottom wall for facilitating molding the protrusion member. The protrusion member is configured with a vertical abutting surface (2280) formed at a lateral end toward the receiving space thereof. The bottom wall forms a mounting surface (2820) for sustaining the CPU chip thereon. A vertical shortest distance is formed between a lowest end of the abutting surface of the protrusion member and the mounting surface of the bottom wall. This configuration can protect the sidewalls of the housing from being scraped during insertion of the package into the housing. Reliable electrical connection between the package and contacts of the land grid array connector is secured.
REFERENCES:
patent: 4923404 (1990-05-01), Redmond et al.
patent: 5387120 (1995-02-01), Marks et al.
patent: 5791486 (1998-08-01), Brahmbhatt
Chen Wen-Chun
Liao Fang-Jwu
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Ta Tho D.
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