Electrical connection substrate having a through hole for connec

Details Electrical connection substrate having a through hole for connec Electrical connection substrate having a through hole for connec

1996-03-14

1999-03-16

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361760, 257774, H01R 909, H05K 702, H01L 2348

Patent

active

058833358

ABSTRACT:
An electrical connection structure for electrically connecting a chip on a mounting surface of a printed circuit board to a back surface of the printed circuit board includes a printed circuit board having a mounting surface and a back surface, the mounting and back surfaces being opposite surfaces of the printed circuit board, a through hole through the printed circuit board and extending from the mounting to the back surface, an electrical conductive layer between the mounting and back surfaces and a layer that permits wiring over the through hole that is electrically isolated from the electrical conductive layer.

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patent: 5473120 (1995-12-01), Ito et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5621193 (1997-04-01), Isaak

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