Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
2008-03-19
2009-02-03
Hyeon, Hae Moon (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
active
07484970
ABSTRACT:
An electrical connection socket structure is configured in a case on a wall. The structure includes a housing, a circuit board and a back plate. The housing and the back plate are made of a plastic material. The circuit board and the back plate are closely stacked on one side of the housing, and an edge of the housing and a back side of the back plate urge the case. Slanted side surfaces at an edge of the back plate urge slanted protruding ribs at an inner side of the housing. Therefore, an external force applied to the housing can be uniformly guided to the case by the back plate, thereby strengthening the structure of the connection socket.
REFERENCES:
patent: 5703754 (1997-12-01), Hinze
patent: 6547572 (2003-04-01), Burdick
patent: 7037124 (2006-05-01), Lee et al.
patent: 7137823 (2006-11-01), Naganishi
patent: 7357650 (2008-04-01), Sasaki et al.
patent: 7367850 (2008-05-01), Chang
patent: 7375981 (2008-05-01), Dickson
patent: 2002/0022387 (2002-02-01), Sumida
patent: 2002/0102871 (2002-08-01), Deep et al.
patent: 2003/0157818 (2003-08-01), Meersschaut
patent: 2005/0186838 (2005-08-01), Debenedictis et al.
patent: 2008/0113530 (2008-05-01), Sakamoto
Apex Juris, PLLC
Heims Tracy M
Hyeon Hae Moon
Patel Harshad C
Surtec Industries Inc.
LandOfFree
Electrical connection socket structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical connection socket structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connection socket structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4103878