Electrical connection of devices incorporating multiple liquid c

Details Electrical connection of devices incorporating multiple liquid c Electrical connection of devices incorporating multiple liquid c

1993-05-27

1995-09-12

Sikes, William L.

Optical: systems and elements

Holographic system or element

Using a hologram as an optical element

359 53, G02F 11343, G02F 1133

Patent

active

054502225

ABSTRACT:
A method for connecting liquid crystal shutters. Multiple flat panel display cells each having opposed active and common substrates are fixed in overlapping relation to one another with each of the active and common substrates having multiple electrodes defined thereon. Multiple heat seal connectors are provided each having conductive paths defined thereon. Each heat seal connector is connected to one of the active and common substrates. Multiple ones of the heat seal connectors are connected to the same printed circuit, which may have a terminating header connector. Connections to a display of the type described are made by placing a display cell in a heat sealing machine, placing a heat seal connector over an edge of an active substrate of the display cell, bringing a heat fixture into contact with the heat sealing connector to heat seal the connector to the substrate, turning over the display cell and replacing the display cell in the heat sealing machine, placing the heat seal connector over an edge of a common substrate of the display cell, bringing a heat fixture into contact with the heat seal connector to heat seal the connector to the substrate, and repeating the foregoing steps for one or more additional display cells. Multiple display cells are then fixed in overlapping relation to one another.

REFERENCES:
patent: 4549174 (1985-10-01), Funada et al.
patent: 5029984 (1991-07-01), Adachi et al.
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5124818 (1992-06-01), Conner et al.
patent: 5168384 (1992-12-01), Genba
patent: 5293262 (1994-03-01), Adachi et al.
Proceedings of the 41st Electronic Components and Technology Conference, Atlanta, Ga., USA, May, 1991, pp. 355-361.
Solid State Technology, vol. 36, No. 1, Jan. 1993, Washington, US pp. 63-66-70-71.

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